JPH0363929U - - Google Patents

Info

Publication number
JPH0363929U
JPH0363929U JP1989124255U JP12425589U JPH0363929U JP H0363929 U JPH0363929 U JP H0363929U JP 1989124255 U JP1989124255 U JP 1989124255U JP 12425589 U JP12425589 U JP 12425589U JP H0363929 U JPH0363929 U JP H0363929U
Authority
JP
Japan
Prior art keywords
bump electrode
bonding pad
neck portion
head
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989124255U
Other languages
English (en)
Japanese (ja)
Other versions
JPH085550Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989124255U priority Critical patent/JPH085550Y2/ja
Publication of JPH0363929U publication Critical patent/JPH0363929U/ja
Application granted granted Critical
Publication of JPH085550Y2 publication Critical patent/JPH085550Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H01L2224/1182—Applying permanent coating, e.g. in-situ coating
    • H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/1354—Coating
    • H01L2224/1356—Disposition
    • H01L2224/13563—Only on parts of the surface of the core, i.e. partial coating
    • H01L2224/13565—Only outside the bonding interface of the bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1989124255U 1989-10-23 1989-10-23 半導体装置 Expired - Lifetime JPH085550Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989124255U JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989124255U JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Publications (2)

Publication Number Publication Date
JPH0363929U true JPH0363929U (en]) 1991-06-21
JPH085550Y2 JPH085550Y2 (ja) 1996-02-14

Family

ID=31672187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989124255U Expired - Lifetime JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Country Status (1)

Country Link
JP (1) JPH085550Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008136304A1 (ja) * 2007-04-28 2010-07-29 木村　太 ゴルフパター練習装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276237A (ja) * 1987-05-08 1988-11-14 Citizen Watch Co Ltd 基板へのｉｃボンディング方法
JPS6439043A (en) * 1987-08-05 1989-02-09 Nippon Denso Co Semiconductor integrated circuit device
JPH01232735A (ja) * 1988-03-11 1989-09-18 Matsushita Electric Ind Co Ltd 半導体装置の実装体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276237A (ja) * 1987-05-08 1988-11-14 Citizen Watch Co Ltd 基板へのｉｃボンディング方法
JPS6439043A (en) * 1987-08-05 1989-02-09 Nippon Denso Co Semiconductor integrated circuit device
JPH01232735A (ja) * 1988-03-11 1989-09-18 Matsushita Electric Ind Co Ltd 半導体装置の実装体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008136304A1 (ja) * 2007-04-28 2010-07-29 木村　太 ゴルフパター練習装置

Also Published As

Publication number Publication date
JPH085550Y2 (ja) 1996-02-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term